| dc.contributor.author | Raja Ahmad Syarufuddin Bin Raja Dahlan | |
| dc.date.accessioned | 2014-12-01T04:10:57Z | |
| dc.date.available | 2014-12-01T04:10:57Z | |
| dc.date.issued | 2014-12-01 | |
| dc.identifier.uri | http://localhost/xmlui/handle/123456789/8778 | |
| dc.description.abstract | Diffusion bonding is a joining process between materials in which the principal mechanism for joint formation is solid state diffusion. Through the application of pressure at high temperature, coalescence of the faying surface can be accomplished. During bonding, no melting and only limited macroscopic deformation or relative motion of the part occurs. Microscopic deformation followed by re-crystallization occurrences. | en_US |
| dc.language.iso | en | en_US |
| dc.title | Design Of Vacuum System Of Diffusion Bonding Equipment For Experimental Purpose | en_US |
| dc.type | Book | en_US |