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DC Field | Value | Language |
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dc.contributor.author | Rabiah Al Adawiyah Ab Rahim | - |
dc.contributor.author | Muhammad Nubli Zulkifli, | - |
dc.contributor.author | Azman Jalar, | - |
dc.contributor.author | Atiqah Mohd Afdzaluddin | - |
dc.contributor.author | Shyong, Kim Siow | - |
dc.contributor.author | UniKL BMI | - |
dc.date.accessioned | 2021-04-10T05:54:04Z | - |
dc.date.available | 2021-04-10T05:54:04Z | - |
dc.date.issued | 2020-12 | - |
dc.identifier.citation | Rabiah Al Adawiyah Ab Rahim, Muhammad Nubli Zulkifli, Azman Jalar, Atiqah Mohd Afdzaluddin & Kim Siow Shyong, Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS) [Kesan penuaan isoterma dan kekasaran permukaan substrat kuprum ke atas pertumbuhan lapisan antara logam sambungan pateri SAC305 pada penyimpanan suhu tinggi (HTS)], Volume 49, Issue 12, December 2020, DOI: 10.17576/jsm-2020-4912-16 | en_US |
dc.identifier.issn | 01266039 | - |
dc.identifier.uri | http://hdl.handle.net/123456789/24885 | - |
dc.description | The article is indexed by Scopus | en_US |
dc.description.abstract | This study aims to evaluate the effect of copper (Cu) substrate surface roughness on the intermetallic compound (IMC) growth and interfacial reaction of SAC305 lead-free solder joint after undergone an aging process. Aging process was conducted using high temperature storage (HTS) at temperature of 150 °C and aging times of 200, 400, 600, 800, and 1000 h. IMC morphology and growth were examined using infinite focus microscope (IFM). Then, the SAC305 solder joint IMC growth kinetic was measured based on power law relationship and diffusion coefficient formula. It was noted that the morphology of IMC for the rougher Cu substrate has scallop-shaped and uniform layer as compared to that of smoother Cu substrate for the initial exposure to the HTS. In addition, Cu substrate with Ra of 579 nm is the turning point for the creation of Cu6Sn5 towards more Cu3Sn of IMC. In addition, Cu substrate with Ra of 579 nm also acts as the turning point for the IMC growth of SAC305 solder joint on Cu substrate for the solid-state diffusion to be happened during 150 °C of aging from grain boundary dominant toward volume diffusion dominant. © 2020 Penerbit Universiti Kebangsaan Malaysia. All rights reserved. | en_US |
dc.language.iso | en | en_US |
dc.publisher | Penerbit Universiti Kebangsaan Malaysia | en_US |
dc.relation.ispartofseries | ;Volume 49, Issue 12, December 2020, Pages 3045-3054 | - |
dc.subject | High temperature storage (HTS) | en_US |
dc.subject | IMC layer growth | en_US |
dc.subject | IMC thickness | en_US |
dc.subject | SAC305 solder | en_US |
dc.subject | Substrate roughness | en_US |
dc.title | Effect of isothermal aging and copper substrate roughness on the SAC305 solder joint intermetallic layer growth of high temperature storage (HTS) [Kesan penuaan isoterma dan kekasaran permukaan substrat kuprum ke atas pertumbuhan lapisan antara logam sambungan pateri SAC305 pada penyimpanan suhu tinggi (HTS)] | en_US |
dc.type | Article | en_US |
dc.conference.name | Sains Malaysiana | en_US |
dc.conference.year | 2020 | en_US |
Appears in Collections: | Journal Articles |
Files in This Item:
File | Description | Size | Format | |
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Effect of Isothermal Aging and Copper Substrate Roughness on the SAC305 Solder.pdf | 731.51 kB | Adobe PDF | View/Open |
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