Please use this identifier to cite or link to this item: http://hdl.handle.net/123456789/8778
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dc.contributor.authorRaja Ahmad Syarufuddin Bin Raja Dahlan-
dc.date.accessioned2014-12-01T04:10:57Z-
dc.date.available2014-12-01T04:10:57Z-
dc.date.issued2014-12-01-
dc.identifier.urihttp://localhost/xmlui/handle/123456789/8778-
dc.description.abstractDiffusion bonding is a joining process between materials in which the principal mechanism for joint formation is solid state diffusion. Through the application of pressure at high temperature, coalescence of the faying surface can be accomplished. During bonding, no melting and only limited macroscopic deformation or relative motion of the part occurs. Microscopic deformation followed by re-crystallization occurrences.en_US
dc.language.isoenen_US
dc.titleDesign Of Vacuum System Of Diffusion Bonding Equipment For Experimental Purposeen_US
dc.typeBooken_US
Appears in Collections:Final Year Project - UniKL MIMET

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