Abstract:
Potting process is a process of filling a completed electronic assembly with a solid compound for resistance to vibration and shock, and for protection from moisture and corrosion. To complete the potting process must use the oven for process baking. So, temperature is one of the key factors to complete the baking process in the oven .The temperature must be stable during process baking to achieve the target. If the temperature not stable, the product will be rejected because the products have the some defect in such the resin system will not harden, cracking on temperature cycling in operation of the unit, bubbles in or on top of hardened potting compound and SMT PC board fails when temperature cycled. Design of Experiments (DOE) and regression equation approach is used in order to achieve the intended model objectives. The combination of both techniques is proposed to result in a reduction of the necessary experimental cost and improve the consistency of oven temperature. It can be stated that the Design of Experiments (DOE) coupled with Regression Equation approach provide a good contribution towards to improve the consistency of oven temperature for Potting Process.
