The Development of Cool/Warmer Compartment using Peltier Effect (TEC)

Abstract

The objective of this project is to design a confined space which can heat or cool the items as required. The mechanism used for cooling and heating is the Peltier Effect Device whereby a normal refrigerant (gases or water) as the thermal media is not used in the design. Peltier effect device are made of N and P type semiconductors that are joined together by metal contact to form a junction that can perform cooling on one side while heating on the other side. The literature review aids better understanding of the project title. Analysis stage helps in problem solving thus decision making process. Tools identification is essential to determine the equipment and software needed in this project. The project is developed using a set of defined procedures and is illustrated more vivid in a logic flowchart. H-Bridge circuit analysis has been carried out with the calculated values of resistors in order to obtain the final working circuit. The temperature controller will consist of temperature sensor which is LM35 and microcontroller Arduino Uno. The coding of the Arduino program has been finalized and programmed. Heat transfer calculation has also been calculated. The outer body of container that will be used for the prototype is PVC. The Peltier is attached at the lid of the container where a hole has been made. The temperature sensor is placed near the Peltier. Between the Peltier and the heat sink, thermal paste is applied evenly to help removing the heat faster. Then, a 12V fan is glued on bottom of the heat sink. This prototype can cool down to 10°C for cooling and go up to 30°C for heating.